Toshiba announced the launch of 32GB embedded NAND flash memory modules that offer the largest density yet announced plus full compliance with the e-MMCTM and eSDTM standards.

The embedded devices are designed for application in mobile digital consumer products, including mobile phones and video cameras. Samples will be available in September 2008, and mass production will start in the fourth quarter.

The new 32GB embedded devices combine eight 32Gbit (=4GB) NAND chips fabricated with Toshiba’s cutting-edge 43nm process technology and also integrate a dedicated controller. Full compliance with JEDEC/MMCA Ver 4.3 and SDA Ver 2.0, high speed memory standards for memory cards as defined by the MultiMediaCard Association and SD Card Association, respectively, supports standard interfacing and simplified embedding in products, reducing development burdens on product manufacturers.

Toshiba offers a line-up of single-package embedded NAND Flash memories which include a controller to manage basic control functions for NAND applications: LBA-NANDTM memory, which has a NAND interface; eSD large capacity chips with SD interface; and e-MMC with an HS-MMC interface.