Solar (photovoltaic) power generation is drawing attention worldwide as environmentally friendly clean energy, and is expected to see widespread use not only for residential use, but also to power mobile devices.

This newly developed solar module makes effective use of compact semiconductor packaging technology to achieve a thickness of just 0.8 mm, the thinnest level in the industry. The solar cells that make up the module are based on polycrystalline silicon and deliver a maximum power of 300 mW , and as an auxiliary power source for mobile devices, will contribute to saving energy. The maximum power output is 4.5 V, and the maximum load current is 67mA. The electrode pattern can be formed on the cell surface to meet the requirements of the device manufacturer, enabling the creation of modules with original designs, and leading to increased design flexibility for mobile devices. Its dimensions are 67.5 x 41.0 x 0.8 mm.

The sample price (tax included) is 3,000 yen. Mass production starts in July 10, 2009. Sharp will produce 100,000 units per month.

Sharp is working to promote the development of environmentally conscious, one-of-a-kind devices and modules.