The components were tested in Duisburg, Germany and Bangalore, India. First products in this new technology are expected to be market-ready towards the end of 2006.

The chip just tested puts more than 30 million transistors on a space of just 33 mm² and proves that Infineon is able to produce such major digital and analog circuitry in cell phones as MCU/DSP cores, storage and analog/mixed-signal in 65-nm technology to operate with high reliability. This space-saving technology was also used to manufacture high-frequency circuits for the first time.

The chip came out of the ICIS research alliance that included Infineon, IBM, Chartered and Samsung. Intel and Altera are also developing 65 nm products. The mobile communications chip developed by Infineon was produced in the frame of a manufacturing agreement with Chartered in Singapore.