Pixelplus announced today that the Company’s highly customized PO3010K common intermediate format (“CIF”) image sensor is featured in the mobile devices of one of the leading Japanese mobile phone manufacturers.
Pixelplus is a leading fabless semiconductor company in Korea that designs, develops and markets complementary metal oxide semiconductor (“CMOS”) image sensors for various imaging applications.
This mobile phone manufacturer is a new end-customer of the Company that recently began incorporating the Company’s PO3010K CIF image sensor in its mobile phone products. Pixelplus furnishes the PO3010K CIF image sensor to a Japanese module maker, which then assembles and supplies the completed modules incorporating the PO3010K CIF image sensor to this mobile phone manufacturer.
Pixelplus’ PO3010K CIF image sensor, which incorporates an image signal processing engine to enhance overall image quality, is one of the industries smallest and most compact with an optical size of 1/11 inch.
Pixelplus developed the PO3010K CIF image sensor in response to the increasing demand for ultra compact camera modules embedded in mobile devices such as third generation (“3G”) mobile phones with dual camera functionality.
At the beginning, Pixelplus estimates that around 200000 to 300000 units will be produced monthly but the production will increase on the next six to twelve months. Pixelplus has also the intention to supply its SXGA 1.3 megapixel CMOS image sensors to the Japanese module maker in the second half of 2006.
“The Company is very excited about these recent developments. Our PO3010K CIF image sensor featured in the mobile phone products of the Japanese mobile phone manufacturer reflects the Company’s continuing efforts to expand our international operations with world leading module makers and mobile phone companies,” said Dr. S.K. Lee, Chief Executive Officer of Pixelplus.
“Looking forward, we intend to actively seek new design wins in the mobile and non-mobile applications markets and will work very closely with existing and potential customers on a worldwide basis to continue to develop our business and technologies in these markets.”