The industry’s top provider of processors for eBooks has joined forces with the leading supplier of eBook electronic paper displays to develop highly integrated embedded solutions that lower costs and foster innovation for eBook manufacturers and their customers.

With support from IBM Research and Nokia Research Center, the VTT Technical Research Centre of Finland created an experimental system that enables people in multiple locations to interact and collaborate with avatars and objects in a single, virtual meeting. Objects and avatars are located in a “virtual” space that mirrors the corresponding physical room.

NXP announced that its SmartMX security chip has been chosen by the Chinese government to power the country’s first ePassport scheme.

SAP and HP announced an agreement through which the companies will integrate the SAP NetWeaver Business Warehouse (SAP NetWeaver BW) component and the HP Neoview enterprise data warehouse platform.

SanDisk began production shipments of flash memory cards based on the company’s advanced X4 flash memory technology. This innovative new technology holds four bits of data in each memory cell, twice as many as the cells in conventional multi-level cell (MLC) NAND (2-bits-per-cell) memory chips.

Intel unveiled the Intel Atom processor CE4100, the newest System-on-Chip (SoC) in a family of media processors designed to bring Internet content and services to digital TVs, DVD players and advanced set-top boxes.

At the Clinton Global Initiative annual meeting, Cisco, Intel, Microsoft, the government of Kenya and the U.S. Agency for International Development (USAID) announced a joint commitment to improve education in Kenya. Launched in collaboration with Kenya’s Ministry of Education, the Accelerating 21st Century Education (ACE) project aims to improve the quality of primary and secondary education through the effective use of information and communications technology (ICT).

ARM and NXP announced at Embedded Systems Conference (ESC), Boston, mbed.org and the mbed microcontroller rapid prototyping tools.

IBM has developed a prototype of the semiconductor industry’s smallest, densest and fastest on-chip dynamic memory device in next-generation, 32-nanometer, silicon-on-insulator (SOI) technology that can offer improved speed, power savings and reliability for products ranging from servers to consumer electronics.

IBM will partner with Western Australia’s International Centre for Radio Astronomy Research (ICRAR) on the technology needed to manage the vast amounts of data produced by the Square Kilometre Array (SKA) telescope project. When constructed, the SKA telescope will be one of the world’s largest scientific instruments.

ARM announced the development of two Cortex-A9 MPCore hard macro implementations for the TSMC 40nm-G process, enabling silicon manufacturers to have a rapid and low-risk route to silicon for Cortex-A9 processor-based devices. The speed-optimized hard macro implementation will enable devices to operate at frequencies greater than 2GHz.

Fujitsu Europe announced the availability of Rack2-Filer, a new approach to personal file management solutions. Rack2-Filer enables users to compose virtual binders filled with digital paper and organize these in graphically animated storage racks or cabinets just like with real paper.

ASUS unveiled five new ultra-slim Designo MS Series LCD monitors MS246H/D, MS236H/D, MS226H, MS227N, MS202N/D with a combination of exceptional style and picture quality.

Verizon Business has extended availability of its on-demand, “cloud-based” Computing as a Service (CaaS) solution to the company’s Amsterdam data center. The announcement reinforces the company’s strategy of expanding cloud-computing deployment resources around the globe to meet the stringent security, performance regulatory requirements of business customers.

WD announced that it is shipping desktop 7200 RPM 2 TB hard drives and is qualifying with OEMs enterprise-class hard drives based on WD’s 500 gigabytes-per-platter technology.

Freescale introduces the MSC8154 processor – a four-core version of Freescale’s high-performance MSC8156 digital signal processor (DSP), designed to add a variety of price, power and throughput options to Freescale’s portfolio of DSPs based on StarCore technology.

Fujitsu Microelectronics and Taiwan Semiconductor Manufacturing Company agreed to collaborate on 28-nanometer (nm) process technology targeted for foundry production of Fujitsu Microelectronics’ 28nm logic ICs and to jointly develop an enhanced 28nm process technology by utilizing TSMC’s technology platform.

NXP Semiconductors launched its latest smart card interface – the TDA8034 – a NDS and EMV 4.2 compliant, cost-optimized solution for the pay-TV market.

NEC Electronics announced the availability of a new image-processing solution, the EMMA3SL/P system-on-chip (SoC) based on NEC Electronics’ enhanced multimedia architecture (EMMA) platform.

After more than 25 years as a pioneer and leader in the mobile industry, Nokia will bring its mobility heritage and knowledge to the PC world with the new, Windows based, Nokia Booklet 3G.

Building on more than 60 years of work with the U.S. military and federal government, HP announced it has been selected by the U.S. Air Force (USAF) to provide new HP Workstation and desktop PCs as part of its enterprise IT purchase program.

SanDisk announced that its SanDisk Cruzer Enterprise secure USB flash drives are enhanced to meet the unique requirements of government employees. The Cruzer Enterprise design was independently tested and certified under Military Standard 810-F environmental standards in addition to being suitable for use by the visually-impaired under Section 508 requirements.

NVIDIA announced that Microsoft’s new Zune HD portable media player is powered by the NVIDIA Tegra processor.

Huawei has been selected by Grameenphone (GP), a subsidiary of Telenor, to deploy Bangladesh’ s first solar-powered base transceiver stations (BTS).

IBM announced new systems software for managing virtualized servers, designed to help clients plan, build and maintain data centers while reducing costs. IBM is also helping clients protect their long-term investments in Power Systems by announcing an upgraded path to its next-generation servers that will include POWER7 microprocessors.