Infineon enables advanced mobile phone features such as camera, mobile Internet and audio-entertainment to now be accessible in low-cost markets with the introduction of the X-GOLD113 and X-GOLD213, its third generation of single chips.

The integration of these features allows customers to reduce the production cost of core mobile functions by up to 40 percent compared to more traditional solutions.

According to market analysts roughly half of the 6.6 Billion people worldwide have not made a phone call, not to mention having used a digital camera or an MP3 player. With the X-GOLD 113 and X-GOLD 213 single chips, Infineon has paved the way for this target group to more mobile applications at an affordable price. As part of a complete mobile platform, this solution enables additional features in price-sensitive markets which previously were only offered in the high-tier segments. Users without personal computers can now access the Internet using their mobile phones while they are on-the-go. In addition digital photos can now be taken and quickly shared. Radio programs or MP3 data can now be availed of without any additional costs.

According to forecasts from the market research company ABI Research, ultra low cost and entry phones had a market share of roughly 16 percent in 2007. This share should rise to nearly 28 percent by 2010.

With the new X-GOLD family, Infineon is taking a further step towards single-chip integration. The baseband, power management unit, RF transceiver and FM radio are now combined on one single die. An ARM11 processor provides the required performance and flexibility required for applications such as a music player, Java, multimedia messaging, e-mail and video functionality.

Available in an 8 x 8 mm wafer level package, the X-GOLD 113 combines a GSM/GPRS modem and all necessary features for a music phone like an audio player, stereo RDS FM radio receiver, stereo headset, class-D amplifier, audio codecs, USB interface as well as interfaces for memory card and Bluetooth. The complete mobile functionality can be realized by the XMM 1130 platform on an area of less than five centimeters squared and with less than 50 components.

The X-GOLD 213 single chip combines the properties of the X-GOLD 113 in the same package size. The X-GOLD 213 chip offers additional functionality including an EDGE Modem, interface for up to 3-megapixel cameras, and additional connectivity for A-GPS, WLAN and Bluetooth. The EDGE functionality and the corresponding factor increase of three in the downlink channel data rates makes the XMM 2130 an ideal platform for real web browsing and messaging. Even when including Bluetooth the platform is still less than six centimeters squared, making it the smallest and most cost attractive browsing platform in the market.

The X-GOLD 113 and the X-GOLD 213 are sampling now and will be available in volume quantities in the first half of 2009. The packages will be produced on Infineon’s pre-announced innovative embedded wafer level ball grid array technology (eWLB).