AMD just released the news that it updated its manufacturing and process technology direction.
Their newest fabrication facility in Dresden will be expanded and will start producing 300mm wafers instead of the old 200 mm wafers. Also, the facility will be renamed from Fab 30 to Fab 38. This means that Dresden will increase the production capacity.
Also, thanks to their collaboration with IBM, both sides engineers managed to finish the 65nm process which will be used at their newest Fab 36 facility located also in Dresden. As for the 45nm technology, well, it is accelerating and AMD said that they will begin initial volume production of 45nm 18 months after initial 65nm production, currently anticipated to be in the mid-2008 time frame.
Using APM (Automated Precision Manufacturing) and CTI (Continuous Technology Improvement), both patented by AMD, they can enable a rapid transition to new technology generations and quickly achieve mature yields. AMD’s focus on speed, accuracy, agility and efficiency via APM is being enhanced through the adoption of a lean philosophy to microprocessor manufacturing. This approach allows AMD to extend the benefits of APM to enhance processes, reduce waste and accelerate time-to-market for our customers.
As for test facilities, the one belonging to Fab 36 will be converted to enable a greater production capacity but new test facilities are being built in Singapore and Suzhou.
That’s all from AMD headquarter. Soft32 out.